Quality of Testing (Fault Coverage, Defect-Level)
Low Power Testing (Under Construction)
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Verify the manufatured chips
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Dimish system cost
- Cost of repair goes up by an order of magnitude each step away from fab line
- Fab line (IC test):
- Fab line is where the chips initially manufatured. At this stage, the defects/faults are cheapest to identify and correct because they are not packaged yet.
- Tools like automatic test equipment (ATE) and wafer-level testing (e.g., probe card) are used here.
- Packaging:
- Chips are packaged and ready for integration into a system
- Board-level testing:
- Packaged chips are integrated onto circuit boards. If a defect is discovered, the entire board may have to be discard.
- System-level testing:
- Boards are integrated into a system or device.
- In the field (End-user stage)
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Improve system reliability (prevent errors occur)
https://www.figma.com/design/kP5fJFrKxJzpsKAo1HYPrU/Untitled?node-id=0-1&t=srQhWGj7N09IJLaM-1
- Using truth table takes huge memory to determine the output value of logic gates
- Not Efficient for multi-input logic gates
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By scanning controlling values and unknown values, efficiently determine the gate output in logic simulation
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$Fault\ Coverage=\frac{The\ num\ of\ Detected\ Faults} {The\ num\ of\ Total\ Faults}$ - The fraction of faults not detected by the testing process (missed faults by the test set)
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$Defect\ Level = 1 - Y^{1-FC}$ (Brown & Williams Model)- It’s a model for PREDICTING the % of Test Escape
- The probability that a defective chip remains undetected and is shipped as a "good" chip
- Use FF, so the enable must hold long enough to start pulsing the clock
- Only start pulsing the clock when SE in up

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